SMART Modular Technologies KTDM8G4B632BGCBCT

SMART Modular Technologies KTDM8G4B632BGCBCT electronic component

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Manufacturer No
KTDM8G4B632BGCBCT
Description
DRAM Chip DDR4 SDRAM 8Gbit 512Mx16 1.2V
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
PPAP
No
DRAM Type
DDR4 SDRAM
ECCN (US)
EAR99
Automotive
No
Availability
No Stock Available
Organization
512Mx16
Interface Type
POD
Chip Density (bit)
8G
Data Bus Width (bit)
16
Manufacturer Lead Time
2 weeks
Operating Current (mA)
201
Address Bus Width (bit)
18
Maximum Access Time (ns)
0.16
Maximum Clock Rate (MHz)
3200
Number of Internal Banks
2
Number of Words per Bank
256M
Number of Bits/Word (bit)
16
Number of I/O Lines (bit)
16
Supplier Temperature Grade
Commercial
Maximum Operating Temperature (°C)
85
Maximum Operating Supply Voltage (V)
1.26
Minimum Operating Supply Voltage (V)
1.14
AttributeValue
PPAPNo
DRAM TypeDDR4 SDRAM
ECCN (US)EAR99
AutomotiveNo
AvailabilityNo Stock Available
Organization512Mx16
Interface TypePOD
Chip Density (bit)8G
Data Bus Width (bit)16
Manufacturer Lead Time2 weeks
Operating Current (mA)201
Address Bus Width (bit)18
Maximum Access Time (ns)0.16
Maximum Clock Rate (MHz)3200
Number of Internal Banks2
Number of Words per Bank256M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)85
Maximum Operating Supply Voltage (V)1.26
Minimum Operating Supply Voltage (V)1.14

Purchase & Inquiry

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Available Payment Methods

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RFQ (Request for Quote)

We recommend submitting an RFQ to receive the latest pricing and inventory information for the parts you need.

Our sales team will respond to your request by email within 24 hours.

Important Notes

1. You will receive an order information email in your inbox. Please check your spam folder if you do not find the email.

2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.

Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 28, 2026 - Oct 29, 2026
Shipping Fee
Calculated based on your destination

Packages

Product before packing

Step1: Product

Product in anti-static bag

Step2: Anti StaticBag

Product in individual packaging

Step3: Individual Packaging

Individual packaging box

Step4: Packaging Boxes

Packaging box with shipping label

Step5: Bar-Code Shipping Tags

Shipping by cargo vessel

Step6: Shipping