SMART Modular Technologies KTDM4G4B626BGIEAT

SMART Modular Technologies KTDM4G4B626BGIEAT electronic component

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Manufacturer No
KTDM4G4B626BGIEAT
Package
BGA
Description
DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin BGA Tray
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
PPAP
No
Mounting
Surface Mount
DRAM Type
DDR4 SDRAM
ECCN (US)
EAR99
Pin Count
96
Automotive
No
Lead Shape
Ball
PCB changed
96
Availability
No Stock Available
Organization
256Mx16
Package Width
7.5
Interface Type
POD
Package Height
0.6(Max)
Package Length
13
Supplier Package
BGA
Chip Density (bit)
4G
Data Bus Width (bit)
16
Standard Package Name
BGA
Manufacturer Lead Time
2 weeks
Operating Current (mA)
319
Address Bus Width (bit)
17
Maximum Access Time (ns)
0.17
Maximum Clock Rate (MHz)
2666
Number of Internal Banks
2
Number of Words per Bank
128M
Number of Bits/Word (bit)
16
Number of I/O Lines (bit)
16
Supplier Temperature Grade
Industrial
Maximum Operating Temperature (°C)
95
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
1.26
Minimum Operating Supply Voltage (V)
1.14
AttributeValue
PPAPNo
MountingSurface Mount
DRAM TypeDDR4 SDRAM
ECCN (US)EAR99
Pin Count96
AutomotiveNo
Lead ShapeBall
PCB changed96
AvailabilityNo Stock Available
Organization256Mx16
Package Width7.5
Interface TypePOD
Package Height0.6(Max)
Package Length13
Supplier PackageBGA
Chip Density (bit)4G
Data Bus Width (bit)16
Standard Package NameBGA
Manufacturer Lead Time2 weeks
Operating Current (mA)319
Address Bus Width (bit)17
Maximum Access Time (ns)0.17
Maximum Clock Rate (MHz)2666
Number of Internal Banks2
Number of Words per Bank128M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.26
Minimum Operating Supply Voltage (V)1.14

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Important Notes

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2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.

Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 28, 2026 - Oct 29, 2026
Shipping Fee
Calculated based on your destination

Packages

Product before packing

Step1: Product

Product in anti-static bag

Step2: Anti StaticBag

Product in individual packaging

Step3: Individual Packaging

Individual packaging box

Step4: Packaging Boxes

Packaging box with shipping label

Step5: Bar-Code Shipping Tags

Shipping by cargo vessel

Step6: Shipping