Microchip Technology MSCM20XM10T3XG

Microchip Technology MSCM20XM10T3XG electronic component

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Manufacturer No
MSCM20XM10T3XG
Package
Module
Packaging
Bulk
Description
MOSFET 6N-CH 200V 108A SP3X
Detailed Description
Mosfet Array 200V 108A (Tc) 341W (Tc) Chassis Mount SP3X
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Packaging
Bulk
Technology
MOSFET (Metal Oxide)
Power - Max
341W (Tc)
Manufacturer
Microchip Technology
Configuration
6 N-Channel (3-Phase Bridge)
Mounting Type
Chassis Mount
Package / Case
Module
Vgs(th) (Max) @ Id
5V @ 250µA
Base Product Number
MSCM20
Operating Temperature
-40°C ~ 125°C (Tc)
Rds On (Max) @ Id, Vgs
9.7mOhm @ 81A, 10V
Supplier Device Package
SP3X
Gate Charge (Qg) (Max) @ Vgs
161nC @ 10V
Drain to Source Voltage (Vdss)
200V
Input Capacitance (Ciss) (Max) @ Vds
10700pF @ 50V
Current - Continuous Drain (Id) @ 25°C
108A (Tc)
AttributeValue
PackagingBulk
TechnologyMOSFET (Metal Oxide)
Power - Max341W (Tc)
ManufacturerMicrochip Technology
Configuration6 N-Channel (3-Phase Bridge)
Mounting TypeChassis Mount
Package / CaseModule
Vgs(th) (Max) @ Id5V @ 250µA
Base Product NumberMSCM20
Operating Temperature-40°C ~ 125°C (Tc)
Rds On (Max) @ Id, Vgs9.7mOhm @ 81A, 10V
Supplier Device PackageSP3X
Gate Charge (Qg) (Max) @ Vgs161nC @ 10V
Drain to Source Voltage (Vdss)200V
Input Capacitance (Ciss) (Max) @ Vds10700pF @ 50V
Current - Continuous Drain (Id) @ 25°C108A (Tc)

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Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 29, 2026 - Oct 30, 2026
Shipping Fee
Calculated based on your destination

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