Step1: Product
BDE Technology BDE-SOM6254T16E2DIA-EB
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Manufacturer
Manufacturer No
BDE-SOM6254T16E2DIA-EB
Packaging
Bulk
Description
HUMAN-MACHINE-INTERACTION SOC WI
Detailed Description
BDE-SOM62x-EB Embedded Module ARM® Cortex®-A53, ARM® Cortex®-M4F, ARM® Cortex®-R5F 400MHz, 1.4GHz 2GB 32MB
Datasheet
Speed
400MHz, 1.4GHz
Series
BDE-SOM62x-EB
RAM Size
2GB
Packaging
Bulk
Flash Size
32MB
Manufacturer
BDE Technology
Connector Type
USB
Core Processor
ARM® Cortex®-A53, ARM® Cortex®-M4F, ARM® Cortex®-R5F
Size / Dimension
5.827" L x 5.512" W (148.00mm x 140.00mm)
Module/Board Type
MPU Core
Operating Temperature
-40°C ~ 85°C
| Attribute | Value |
|---|---|
| Speed | 400MHz, 1.4GHz |
| Series | BDE-SOM62x-EB |
| RAM Size | 2GB |
| Packaging | Bulk |
| Flash Size | 32MB |
| Manufacturer | BDE Technology |
| Connector Type | USB |
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F, ARM® Cortex®-R5F |
| Size / Dimension | 5.827" L x 5.512" W (148.00mm x 140.00mm) |
| Module/Board Type | MPU Core |
| Operating Temperature | -40°C ~ 85°C |
Purchase & Inquiry
Placing an Order
You may place an order on DAXIN without creating an account.
Available Payment Methods
For your convenience, we accept several payment methods in USD, including PayPal, credit card, and wire transfer.
RFQ (Request for Quote)
We recommend submitting an RFQ to receive the latest pricing and inventory information for the parts you need.
Our sales team will respond to your request by email within 24 hours.
Important Notes
1. You will receive an order information email in your inbox. Please check your spam folder if you do not find the email.
2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.
Payment Method
Shipping Method
- Shipped from
- Hongkong/Shenzhen warehouse
- Estimated Ship Date
- Oct 28, 2026 - Oct 29, 2026
- Lead Time
- Contact us to confirm availability
- Shipping Fee
- Calculated based on your destination
Packages
