Step1: Product
Alif Semiconductor AE302F40C1537LE-Y
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Manufacturer
Manufacturer No
AE302F40C1537LE-Y
Package
FBGA
Packaging
Tray
Description
MCU 32-bit ARM Cortex M55 RISC 1.8V 194-Pin FBGA Tray
Datasheet
HTS
8542.31.00.25
I2C
5
I2S
5
SPI
5
USB
1
PPAP
Unknown
UART
9
EU RoHS
Compliant
Ethernet
1
Mounting
Surface Mount
RAM Size
3.75MB
ECCN (US)
5A002
Packaging
Tray
Pin Count
194
Automotive
Unknown
Lead Shape
Ball
Device Core
ARM Cortex M55
Family Name
Ensemble
PCB changed
194
ADC Channels
18/18/18/4
Availability
No Stock Available
DAC Channels
2
No. of Timers
16
Package Width
10
Interface Type
Ethernet/I2C/I2S/I3C/SPI/UART/USB
Number of ADCs
4
Number of DACs
1
Number of I/Os
88
Package Height
0.96
Package Length
10
Supplier Package
FBGA
Core Architecture
ARM
ADC Resolution (bit)
12/12/12/24
DAC Resolution (bit)
12
Data Bus Width (bit)
32
Standard Package Name
BGA
Manufacturer Lead Time
16 weeks
Supplier Temperature Grade
Extended
Maximum CPU Frequency (MHz)
400
Instruction Set Architecture
RISC
Maximum Clock Frequency (MHz)
400
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
1.98
Minimum Operating Supply Voltage (V)
1.62
Typical Operating Supply Voltage (V)
1.8
| Attribute | Value |
|---|---|
| HTS | 8542.31.00.25 |
| I2C | 5 |
| I2S | 5 |
| SPI | 5 |
| USB | 1 |
| PPAP | Unknown |
| UART | 9 |
| EU RoHS | Compliant |
| Ethernet | 1 |
| Mounting | Surface Mount |
| RAM Size | 3.75MB |
| ECCN (US) | 5A002 |
| Packaging | Tray |
| Pin Count | 194 |
| Automotive | Unknown |
| Lead Shape | Ball |
| Device Core | ARM Cortex M55 |
| Family Name | Ensemble |
| PCB changed | 194 |
| ADC Channels | 18/18/18/4 |
| Availability | No Stock Available |
| DAC Channels | 2 |
| No. of Timers | 16 |
| Package Width | 10 |
| Interface Type | Ethernet/I2C/I2S/I3C/SPI/UART/USB |
| Number of ADCs | 4 |
| Number of DACs | 1 |
| Number of I/Os | 88 |
| Package Height | 0.96 |
| Package Length | 10 |
| Supplier Package | FBGA |
| Core Architecture | ARM |
| ADC Resolution (bit) | 12/12/12/24 |
| DAC Resolution (bit) | 12 |
| Data Bus Width (bit) | 32 |
| Standard Package Name | BGA |
| Manufacturer Lead Time | 16 weeks |
| Supplier Temperature Grade | Extended |
| Maximum CPU Frequency (MHz) | 400 |
| Instruction Set Architecture | RISC |
| Maximum Clock Frequency (MHz) | 400 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 1.98 |
| Minimum Operating Supply Voltage (V) | 1.62 |
| Typical Operating Supply Voltage (V) | 1.8 |
Purchase & Inquiry
Placing an Order
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Available Payment Methods
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RFQ (Request for Quote)
We recommend submitting an RFQ to receive the latest pricing and inventory information for the parts you need.
Our sales team will respond to your request by email within 24 hours.
Important Notes
1. You will receive an order information email in your inbox. Please check your spam folder if you do not find the email.
2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.
Payment Method
Shipping Method
- Shipped from
- Hongkong/Shenzhen warehouse
- Estimated Ship Date
- Oct 28, 2026 - Oct 29, 2026
- Lead Time
- Contact us to confirm availability
- Shipping Fee
- Calculated based on your destination
Packages
